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HSMx-A4xx-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Description Avago Power PLCC-4 is an extension of our PLCC-2 SMT LEDs. The package can be driven at higher current due to its superior package design. The product is able to dissipate heat more efficiently compared to the conventional PLCC-2 SMT LEDs. In proportion to the increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of environmental conditions. This higher reliability makes them suitable for use under harsh environment and conditions like automotive. In addition, they are also suitable to be used in electronic signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-thewave soldering process. There are a variety of colors and various viewing angles (30, 60 and 120) available in these SMT LEDs. Ideally, the 30 parts are suitable for light piping where focused intensities are required. As for the 60 and 120, they are most suitable for automotive interior and exterior lighting and electronic signs applications.
Features * Industry standard PLCC-4 * High reliability LED package * High brightness using AlInGaP and InGaN dice technologies * High optical efficiency * Higher ambient temperature at the same current possible compared to PLCC-2 * Available in full selection of colors * Super wide viewing angle at 120 * Available in 8mm carrier tape on 7-inch reel * Compatible with both IR and TTW soldering process JEDEC MSL 2a Applications * Interior automotive - Instrument panel backlighting - Central console backlighting - Cabin backlighting - Navigation and audio system - Dome lighting - Push button backlighting * Exterior automotive - Turn signals - CHMSL - Rear combination lamp - Puddle light * Electronic signs and signals - Interior full color sign - Variable message sign * Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting - Display backlighting
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 0.2 2.2 0.2 A C 0.1 TYP. 1.9 0.2 0.8 0.1
3.2 0.2
3.5 0.2
0.8 0.3 C C 0.7 0.1 CATHODE MARKING NOTES: ALL DIMENSIONS IN mm. ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED.
0.5 0.1
Device Selection Guide Color Red Part Number HSMC-A400-S30M1 HSMC-A401-T40M1 HSMC-A401-T80M1 HSMZ-A400-U80M1 HSMJ-A401-T40M1 HSMJ-A401-U40M1 HSMV-A400-U80M1 HSML-A401-U40M1 HSMA-A400-T35M1 HSMA-A401-U45M1 HSMU-A400-U85M1 HSME-A401-P4PM1 HSMM-A401-R7YM2 HSMM-A401-S4YM2 HSMM-A401-S7YM2 HSMM-A400-T8YM2 HSMK-A401-R40M2 HSMK-A400-T80M2 HSMN-A401-P4QM2 HSMN-A401-P7QM2 HSMN-A400-Q8QM2 Min. IV (mcd) 180.00 285.00 355.00 560.00 285.00 450.00 560.00 450.00 285.00 450.00 560.00 45.00 140.00 180.00 224.00 355.00 112.50 355.00 45.00 56.00 90.00 Max. IV (mcd) 355.00 715.00 900.00 1400.00 715.00 1125.00 1400.00 1125.00 560.00 1125.00 1400.00 112.50 285.00 450.00 450.00 900.00 285.00 900.00 112.50 112.50 224.00 Test Current (mA) 50 50 50 50 50 50 50 50 50 50 50 50 30 30 30 30 30 30 30 30 30 Dice Technology AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN
Red Orange
Orange Amber
Emerald Green Green
Cyan Blue
Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. IV tolerance = 12 %.
2
Part Numbering System HSM x1 - A x2 x3x4 - x5x6 x7 x8x9
Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color
Absolute Maximum Ratings (TA = 25C) Parameters DC Forward Current[1] Peak Forward Current [2] Power Dissipation Reverse Voltage Junction Temperature Operating Temperature Storage Temperature HSMC/J/L/A/E 70 mA[3,4] 200 mA 180 mW HSMZ/V/U 70 mA[3,4] 200 mA 240 mW 5V 110C -40C to +100C -40C to +100C HSMM/K/N 30 mA 90 mA 114 mW
Notes: 1. Derate linearly as shown in figure 5. 2. Duty factor = 10%, Frequency = 1 kHz. 3. Drive current between 10 mA and 70 mA is recommended for best long-term performance. 4. Operation at currents below 5 mA is not recommended.
3
Optical Characteristics (TA = 25C) Peak Wavelength PEAK (nm) Typ. 635 639 621 623 609 592 594 576 568 518 502 468 Dominant Wavelength D[1] (nm) Typ. 626 630 615 617 605 590 592 575 567 525 505 470 Viewing Angle 21/2[2] (Degrees) Typ. 120 120 120 120 120 120 120 120 120 120 120 120 Luminous Efficacy v[3] (lm/W) Typ. 150 155 240 263 320 480 500 560 610 500 300 75 Luminous Intensity/ Total Flux Iv (mcd)/v (mlm) Typ. 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45
Color Red Red Orange Orange Amber Yellow Green Emerald Green Green Cyan Blue
Part Number HSMC HSMZ HSMJ HSMV HSML HSMA HSMU HSME HSME HSMM HSMK HSMN
Notes: 1. The dominant wavelength, D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25C) Forward Voltage VF (Volts) @ IF = 50 mA Typ. Max. 2.2 2.8 2.5 3.4 Reverse Voltage VR @ 100 A Min. 5 5 Reverse Voltage VR @ 10 A Min. 5
Part Number HSMC/J/L/A/E HSMZ/V/U
Part Number HSMM/K/N
Forward Voltage VF (Volts) @ IF = 30 mA Typ. Max. 3.8 4.6
1.0 0.9
RELATIVE INTENSITY
BLUE CYAN GREEN
EMERALD GREEN YELLOW GREEN AMBER
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 480 530 580 630 680 730 780 RED ORANGE RED ORANGE
WAVELENGTH - nm
Figure 1. Relative Intensity Vs. Wavelength.
4
80
1.4 1.2
RELATIVE INTENSITY (NORMALIZED AT 50 mA)
HSMC/J/L/A/E HSMZ/V/U
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 30 mA)
1.2 1.0 0.8 0.6 0.4 0.2 0
FORWARD CURRENT - mA
70 60 50 40 30 20 10 HSMM/K/N 0 0 1 2 3 4 5
1.0 0.8 0.6 0.4 0.2 0 0 10 20 30 40 50 60 70 80
0
5
10
15
20
25
30
35
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
FORWARD CURRENT - mA
Figure 2. Forward Current Vs. Forward Voltage.
Figure 3. Relative Intensity Vs. Forward Current (AlInGaP).
Figure 4. Relative Intensity Vs. Forward Current (InGaN).
MAXIMUM FORWARD CURRENT - mA
MAXIMUM FORWARD CURRENT - mA
80 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 470C/W 350C/W 300C/W
35
DOMINANT WAVELENGTH - nm
540 530 520 510 500 490 480 470 460 0 5 10 15 InGaN BLUE 20 25 30 35 InGaN CYAN InGaN GREEN
30 300C/W 25 350C/W 20 470C/W 15 10 5 0 0 20 40 60 80 100 120
AMBIENT TEMPERATURE - C
AMBIENT TEMPERATURE - C
CURRENT - mA
Figure 5a. Maximum Forward Current Vs. Ambient Temperature, Derated Based On TJmax = 110C (AlInGaP).
Figure 5b. Maximum Forward Current Vs. Ambient Temperature, Derated Based On TJmax = 110C (InGaN).
Figure 6. Dominant Wavelength Vs. Forward Current - InGaN Devices.
1.0 0.9
RELATIVE INTENSITY
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -70 -50 -30 -10 10 30 50 70 90
ANGLE - DEGREES
Figure 7. Radiation Pattern.
5
X 2.60 (0.103) 1.10 (0.043)
X 0.40 (0.016)
0.50 (0.020) 4.50 (0.178)
Y
1.50 (0.059) Y
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS
Figure 8a. Recommended Soldering Pad Pattern.
6.1 (0.240) 2.8 (0.110)
X
X 0.5 (0.020)
Y 2.0 (0.079)
6.0 (0.236) 2.0 (0.079) 3.0 (0.118) Y 1.0 (0.039)
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS
Thermal Resistance 300C/W 350C/W 470C/W
Solder Pad Area (xy) >16 mm2 >12 mm2 >8 mm2
10 to 20 SEC. 255 C +5 C -0 C 6 C/SEC. MAX.
Figure 8b. Recommended Soldering Pad Pattern (TTW).
217 C
TEMPERATURE
3 C/SEC. MAX. 125 C 25 C
20 SEC. MAX.
TEMPERATURE
240C MAX. 3C/SEC. MAX. 100-150C 3C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME
183C -6C/SEC. MAX.
MAX. 120 SEC.
60 to 150 SEC.
TIME * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 9a. Recommended SnPb Reflow Soldering Profile.
TURBULENT WAVE
250
TEMPERATURE - C
LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD
Figure 9b. Recommended Pb-free Reflow Soldering Profile. Note: For detailed information on reflow soldering of Avago surface mount LEDs, refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
200 150
FLUXING
TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.
100 50 30 0 10
PREHEAT
20
30
40
50
60
70
80
90
100
TIME - SECONDS
Figure 10. Recommended Wave Soldering Profile.
6
TRAILER 200 mm MIN. FOR 180 REEL. 200 mm MIN. FOR 330 REEL.
COMPONENT
LEADER 480 mm MIN. FOR 180 REEL. 960 mm MIN. FOR 330 REEL.
C
A
USER FEED DIRECTION
Figure 11. Tape Leader and Trailer Dimensions.
+0.1 1.5 -0
4 0.1
2 0.05
B
3.6 0.1 1.75 0.1
C 5.5 0.05 A A 3.8 0.1 +0.3 12-0.1 C +0.1 -0
C
A
1 8 0.1
B 0.229 0.01 3.45 0.1 VIEW B-B
VIEW A-A
Figure 12. Tape Dimensions.
ALL DIMENSIONS IN mm.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 13. Reeling Orientation.
7
Intensity Bin Select (X5X6) Individual reel will contain parts from one half bin only. X5 X6 0 3 4 5 7 8 9 Full Distribution 3 half bins starting from X51 4 half bins starting from X51 5 half bins starting from X51 3 half bins starting from X52 4 half bins starting from X52 5 half bins starting from X52 Min. Iv Bin
Color Bin Select (X7) Individual reel will contain parts from one full bin only. X7 0 Z Y W V U T S Q P N Full Distribution A and B only B and C only C and D only D and E only E and F only F and G only G and H only A, B and C only B, C and D only C, D and E only D, E and F only E, F and G only F, G and H only A, B, C and D only E, F, G and H only B, C, D and E only C, D, E and F only A, B, C, D and E only B, C, D, E and F only
Color Bin Limits Emerald Green Min. (nm) A 552.5 B 555.5 C 558.5 D 561.5 Yellow Green E F G H Amber/ Yellow A B C D E F Orange A B C D E Red Orange A B
Max. (nm) 555.5 558.5 561.5 564.5
Min. (nm) 564.5 567.5 570.5 573.5
Max. (nm) 567.5 570.5 573.5 576.5
Intensity Bin Limits Bin ID N1 N2 P1 P2 Q1 Q2 R1 R2 S1 S2 T1 T2 U1 U2 V1 V2 W1 W2 Min. (mcd) 28.50 35.50 45.00 56.00 71.50 90.00 112.50 140.00 180.00 224.00 285.00 355.00 450.00 560.00 715.00 900.00 1125.00 1400.00 Max. (mcd) 35.50 45.00 56.00 71.50 90.00 112.50 140.00 180.00 224.00 285.00 355.00 450.00 560.00 715.00 900.00 1125.00 1400.00 1800.00
M L K 1 2 3 4 5 6
Min. (nm) 582.0 584.5 587.0 589.5 592.0 594.5 Min. (nm) 597.0 600.0 603.0 606.0 609.0
Max. (nm) 584.5 587.0 589.5 592.0 594.5 597.0 Max. (nm) 600.0 603.0 606.0 609.0 612.0
Color Bin Limits Blue Min. (nm) A 460.0 B 465.0 C 470.0 D 475.0 Cyan A B C D Green A B C D Min. (nm) 490.0 495.0 500.0 505.0 Min. (nm) 515.0 520.0 525.0 530.0
Max. (nm) 465.0 470.0 475.0 480.0 Max. (nm) 495.0 500.0 505.0 510.0 Max. (nm) 520.0 525.0 530.0 535.0
Min. (nm) 611.0 616.0
Max. (nm) 616.0 620.0 Max. (nm)
Tolerance of each bin limit = 12%
Red Min. (nm) Full Distribution
Tolerance of each bin limit = 1 nm
Packaging Option (X8X9) Test Package Option Current Type M1 50 mA Top Mount M2 30 mA Top Mount
Reel Size 7 inch 7 inch
8
Forward Voltage Bin Table For HSMZ/V/U - A4xx-xxxxx only BIN VA VB VC VD VE MIN. 1.9 2.2 2.5 2.8 3.1 MAX. 2.2 2.5 2.8 3.1 3.4
Tolerance of each bin limit = 0.05
This product is qualified as Moisture Sensitive Level 2a per JEDEC JSTD-020. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Refer to Avago Application Note AN 5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g., for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C/60% RH at all times and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours. C. Control of unfinished reel - Unused LEDs need to be stored in sealed MBB with desiccant or in desiccator at <5% RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB needs to be stored in sealed MBB with desiccant or in desiccator at <5% RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - "10%" or "15%" HIC indicator turns pink. - The LEDs are exposed to conditions of >30C/60% RH at any time. - The LEDs' floor life exceeds 672 hours. Recommended baking conditions: 605C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0312EN AV02-0479EN June 20, 2007

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